Improved reliability and robustness through the patent-pending QuadroLock active wedge lock technology, enabling X9 Spider modules to interlock to withstand severe noise, vibration and harshness while simultaneously transferring heat between modules for maximum cooling.Six (6) companion X9 modules including: ‘Workstation’ with removable storage and up to 14 sites for add-in I/O like MIL-STD-1553 Network ‘Switch’ with four 100Gb and eight 10Gb Ethernet ports ‘Storage’ with removable canister and up to eight high-density M.2 or U.2 SSD storage devices ‘GPGPU’ with NVIDIA RTX-5000 GPGPU and custom I/O module such as video frame grabber for autonomous driver sensors and utility X9 Spider modules for ‘Power’ and ‘Cooler’.Two ‘Host’ modules with a range of storage and network capabilities powered either by Intel’s latest 11th-gen Xeon W (Tiger Lake-H) 8-core CPU, or by NVIDIA’s Jetson AGX Orin GPGPU with ARMcore engine, plus GPGPU CUDA and Tensor cores.Also, 100Gb Ethernet over fibre connects X9 Spider modules to each other and to other high-speed systems Interconnectivity via the COTS open standard Thunderbolt 4 technology, developed by Intel and Apple.Much of the X9 spider technology was invented and patented by GMS.

This kind of upgradeability gives the DoD, primes, and system developers limitless possibilities with very low upgrade costs. The X9 Spider also connects directly to next-gen sensors without intermediate electronics – simplifying their connection to the electronic system – making the sensors themselves equally scalable and modular.

An X9 module literally fits in the palm of your hand like a cell phone.īuilt for limitless expandability, the X9 Spider family is based on new, patent-pending mechanical features that allow devices to stack and connect together electrically, physically and thermally but at light speed (literally) with minimal signal bottlenecks. “By breaking the outdated and needlessly expensive, centralised ATR-style board-and-chassis paradigm into Thunderbolt technology-connected distributed compute modules, the X9 Spider family gives designers ruggedised, as-needed capabilities to solve any compute problem in any environment – from the smallest enclosure to the largest C5ISR system.” Rugged X9 Spider modules are small and modular, plug-and-play, and emphasise flexibility over ATR chassis’ physical and electrical constraints.

“Next-generation platforms like aircraft, vehicles, UAS and sensor systems require next-generation capabilities to maximise computing resources in lean, flexible and cost-effective ways,” said Ben Sharfi, Chief Architect and CEO, GMS.

Chief architect product key x9